Mixed Signal ASIC Design

Custom Design : Experience in special applications

• IR detectors / preamplifers / multiplexers
• Micro-power A/D and D/A converters
• X-ray and high energy particle detectors and interface chips
• Radiation hard versions of above
• Image sensors (CMOS and CCD)
• Image processors
• Integrated liquid crystal drivers

Chip Size Extremes

• 300um diameter die size imagers for medical applications
• 17x19 mm^2 display driver for projection displays
• 51x25 mm^2 visible/scintillator x-ray sensor (using stiching)

Speeds and Signals

• as high speed as 2Ghz analog bandwidth CMOS for LADAR range sensing

• down to single photon detection

• from far infrared to high energy particle readout processors

• 1.8V to 22V (or higher) mixed mode CMOS

Device Interfaces

• on-chip analog, digital, and instruction based interfaces

• PCB designs and interfaces using FPGA, CPLD, and micro-processor, and analog/digital components

 

Custom IC Fablication : The right process for each application

note: The "Special" field is used to indicate if a foundry has Stitching or MPW services and/or is ITAR compliant.  All units are in um.

Extensive Experience with Multi-Project Wafer (MPW) runs for prototyping

• MOSIS (California)

• EUROPRACTICE (Belgium, Germany)

note: Some foundries will provide their own MPW service.

Experience with a variety of Processes

• CMOS

• CMOS/CCD

• Bi-CMOS

• CMOS-SOS

Custom Testing and System Interface : Performance to your requirements

• Testing the proper parameters for your application -
  prototype to small volume production
• Wafer probing and testing at cryogenic temperatures available
• Solutions for system interface problems:
  • Interface electronics
  • High density interconnect
  • Special packaging
  • Optics